integrated circuits
Research Topic
Language: English
This is a research topic created to provide authors with a place to attach new problem publications.
Research problems linked to this topic
- There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue.
- On-chip VLSI interconnects is considered very promising area in the field of IC design in recent years.
- Microelectronics and, particularly, silicon integrated circuit microelectronics, has produced amazing capabilities over the last 40 years.
- Silicon doped with rare-earth metal erbium is a promising material for the fabrication of highly efficient light emitting structures that can be easily integrated into silicon electronics.
- Advanced integrated circuits (ICs) are complex due to the fin field effect transistors (FinFETs), which comprise multigate transistors with the source/drain (S/D) channels (fins) surrounded by a threedimensional gate.
- With the rapid increase in the number of integrated circuits I/O, the traditional wire bonding package has been unable to meet the high I/O number of interconnection needs, flip-chip process can undoubtedly solve the high I/O number of miniaturization package problems, especially flip-chip plastic package can fundamentally meet the increasing number of pins, improve speed and high frequency performance, and reduce power dissipation.
- Integrated circuits are often subjected to mechanical stress resulting from external loads or intrinsic stress caused by the mismatch in thermal expansion coefficients of the applied materials.
- Modern system-on-chip (SoC) designers are trying to include more considerations in designing building blocks to present reliable integrated digital circuits as well as high-density, high-speed, and low-power ones.
- Three-dimensional (3D) integrated circuit (IC) packaging technology is under rapid development to realize high-density and high-speed transmission, and through silicon via (TSV) as advanced bonding technology is used to connect the wafers in chips extensively.