nitride materials
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- Nitrile rubber (NBR) blends with excellent performance have always been a hot research topic in oil drilling process.
- Ambient moisture is a cause of current collapse in AlGaN/GaN high-electron-mobility transistors.
- The structure and properties of Co-N, Co-Fe-N, and Co-Zr-N films, prepared by rf reactive sputtering using nitrogen and argon gases, have been studied.
- Electroless nickel-high-phosphorus Ni-P plating is known for its physical properties.
- InGaN/AlGaN ultraviolet light-emitting diodes (UV LEDs) with AlGaN barriers having various Si doping concentrations are grown by metal-organic chemical vapor deposition.
- In integrated circuit production, copper is gradually replacing aluminum as a lead and trace material because of its much lower resistance. Cu–Sn intermetallics compounds (IMCs) are easily formed by the reaction of copper and tin. Hence, it is important to select a proper material as a diffusion barrier between copper and tin to prevent the formation of IMCs and result in poor reliability of the solder bump.
- Duplex coatings plasma nitriding followed by physical vapour deposition (PVD) coating have been given a lot of interest as surface treatment for forming and cutting tools in recent years.
- The influence of thermal treatment on the microstructure and electrical and optical properties of SnS films obtained by the hot-wall method has been investigated.
- W-Ni-Fe alloys are important materials for many practical applications; however, at present, they are usually fabricated by conventional powder metallurgy techniques, which is difficult in fabrication with complex shapes.