thermal barrier
Research Topic
Language: English
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Research problems linked to this topic
- Earth to Air Heat Exchanger (EAHE), limited convective heat transfer coefficient and limitation of available space have been the main concern of scientists.
- Ceramic thermal barrier coating systems will be of growing importance for the reusable high performance engine.
- Increased heat generated in high-density electronic devices has intensified the search for advanced thermal management solutions.
- Endothermic catalytic cracking of hydrocarbon fuel is a promising technique for active thermal protection of advanced aircrafts.
- Miniature heat pipes (MHP) are passive heat transport devices mainly considered in electronics packaging for high heat flux acquisition and transport.
- Jet impingement is encountered in numerous applications demanding high heating or cooling fluxes.
- Scraped surface heat exchangers (SSHEs) provide a versatile solution in the process industry for treating highly viscous fluids that may also contain particulate matter.
- Preventing ice buildup on surfaces is crucial for ensuring the proper operation and safety of airplanes, ships, communication towers, and wind turbines.
- The development of thermal protection systems (TPS) for re-entry vehicles has been a topic of interest since the inception of manned space flight.
- Due to aerodynamic heating, flight vehicles at supersonic speeds are subjected to surface panel temperatures that can potentially reach several hundred degrees.
- Protective performance and a low weight of armour plates are the most important objective in security applications.
- Slag freeze-lining reactor wall protection is a widely used technology in high temperature reaction systems.
- Fouling on the heat exchanger surface during food processing has been researched extensively due to its great importance in energy efficiency, product quality and food safety.
- The falling film flow has gained wide attention in recent years, due to its extraordinary performance in different heat exchangers in terms of high heat transfer coefficient and low energy consumption.
- The necessity of increased heat transfer surface area has resulted in the development of compact heat exchangers, which are widely used in the aerospace and automobile industries.
- New generation supercomputers with three dimensional stacked chip architectures pose a major challenge with respect to the removal of dissipated heat, which can reach currently as high as 250 W/cm 2 in multilayer chip stacks of less than 0.
- Vapor compression refrigeration (VCR) cooling has been identified as a promising solution to ensure the low-temperature sustainable operation of photonics, avionics and electronics in extreme hot weather.
- Pressure sensors working at temperatures of about 500C impose new challenges in packaging due to thermal cross- sensitivity and temperature induced stresses on the package.
- Flat plate oscillating heat pipe (FP-OHP) is a unique heat transfer device and considered as a promising candidate for effective heat transfer device in electronics industries.
- Thermal barrier coatings (TBC) in service are prone to the attack by molten calcium-magnesium aluminosilicates (CMAS) resulting from the ingestion of siliceous minerals (dust, sand, volcanic ash) by the aeroengines.