fabrication advanced
Research Topic
Language: English
This is a research topic created to provide authors with a place to attach new problem publications.
Research problems linked to this topic
- High-resolution lithography often involves thin resist layers which pose a challenge for pattern characterization.
- Creep age forming (CAF) is an advanced forming technology used for manufacturing large complex integrated panel components.
- Tools used in die casting, hot rolling, extrusion and hot forging are exposed to high cyclic temperatures and mechanical loads.
- As the demand for flip-chip products increases, the need for high volume, low cost manufacturing processes also increases.
- The fabrication of advanced laser fusion targets requires careful attention to materials properties that are unimportant in target design.
- Micro-machining of a brittle material such as glass or silicon is important in micro fabrication.
- As nanotechnology advances, fabrication techniques based on focused ion beams (FIB) are expected to be useful in manufacturing complex microstructures.
- Injection molding is one of the most significant material processing methods for mass production of plastic products.
- Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer.
- Accumulative Roll Bonding (ARB) is a severe plastic deformation technique for producing ultra-fine grain structures in sheet metal.
- The established commercially available rapid prototyping techniques are now well known throughout the manufacturing community.
- The machinings of aircraft parts and die molds highly require fine surfaces at high production rates in terms of reliability.
- Roll-to-roll manufacturing of micro components based on advanced printing, structuring and lamination of ceramic tapes is rapidly progressing.
- Powder injection molding (PIM) is a means of mass-producing various metal or ceramic three-dimensional components in large production quantities at low costs.
- Sintered silver (Ag) die-attach has attracted much attention in assembling power modules for high power density and high temperature operation.
- An additive technology can produce complex geometries which might not have been possible to produce using traditional manufacturing techniques.
- Abrasive water jet (AWJ) milling has speedily developed in popularity due to its adaptability and fast production of blind features like channels, pockets etc.
- Development, optimisation and qualification of welding and additive manufacturing procedures to date have largely been undertaken on an experimental trial and error basis, which imposes significant costs.
- With increasing demand for microstructure shape accuracy for MEMS and optoelectronic devices, controllability of shape and morphology in micro-fabrication has become increasingly crucial.
- In injection moulded products using fibre reinforced plastics, weld line was unavoidable due to mould shaping factors such as the position and size and number of mould gates.
- In-situ process monitoring in Electron Beam Melting (EBM) is critical in certifying build quality, by identifying contamination from the feedstock and condensate spallation from within the build area.
- Wire electric discharge machining (WEDM) is emerging as an advance machining process, widely used to cut difficult-to-machine materials with intricate shapes and complex profiles but machining of nickel based super alloys is found one of the challenging tasks in recent years.
- As mechanical engineering industry encounters a growing demand of µm-sized or µm-structured components for an increasing range of applications, miniaturization is presently ranking among the most important goals in product and tool development.
- Waste electrical and electronic equipment is a significant source of material that can contribute to reduce environmental impacts associated to extraction and discard stages; therefore, it is necessary to develop efficient recycling processes for components such as Printed Circuit Boards (PCBs).
- Thinner silicon die is the key to reach the target of thin semiconductor product in 3D assembly, stacked die cross-hand design has high risk to cause silicon die which thickness less than 100 micron damage during wire bond and compound molding processes.
- Equal channel angular pressing (ECAP) is a materials processing method that allows very high strains to be imposed, leading to extreme work hardening and microstructural refinement, with minimal change of external sample dimensions.
- Sputtered indium tin oxide (ITO) coating on polyethylene terephthalate film has been used as the substrate for roll-to-roll fabrication of large area printed electronics devices, but it is expensive and could be cracked when bending, limiting its applications.
- Propulsion system development requires new, more affordable manufacturing techniques and technologies in a constrained budget environment, while future in-space applications will require in-space manufacturing and assembly of parts and systems.
- Given the current trend in manufacturing to decrease part variability, and in order to increase product quality, dimensional tolerances are becoming more exacting.