Dielectric breakdown in 2D insulating films for future logic device technology is not well understood yet, in contrast to the extensive insight we have in the breakdown of bulk dielectric films, such as HfO2 and SiO2.

S. Octopus

Publication type:Research Problem

Published:December 6, 2022

Language:English

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CC BY 4.0

DOI:

https://doi.org/10.57874/jj33-tc33

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dielectric constant

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